Tool Type:Automated Semiconductor Bonding
Bonding Technology:Intricate Micro-Bonding
Maximum Workpiece Size:Up to 6 inches
Process Speed:Up to 1200 parts per hour
Bonding Force Range:20 to 200gf
Temperature Control:±0.1°C
Vacuum Level:99.99%
Power Consumption:1500W
Dimensions:420mm x 450mm x 700mm
Weight:250kg
Integrating cutting-edge technology, the K&S AS-261-0-02 offers unparalleled precision in semiconductor assembly, ensuring high-quality output for the most demanding applications.
Crafted from durable, industrial-grade materials, this system is built to withstand the rigors of continuous operation in high-volume production environments.
With its modular design, the AS-261-0-02 allows for easy customization to meet specific production requirements, providing flexibility and adaptability across various industries.
Our system incorporates advanced error detection and correction mechanisms, significantly reducing downtime and enhancing overall operational efficiency.
Comprehensive support includes installation, training, and maintenance services to ensure seamless integration into your manufacturing process and maximize productivity.
There are no reviews yet.